Welcome to NetVia Group!

NetVia Group is a manufacturer of high-reliability, advanced circuit technology. For over 35 years, the most advanced and innovative technology companies have relied on NetVia Group for all of their time-critical, high performance PCB solutions.

We specialize in double sided, multi-layer, rigid, flex and rigid-flex printed circuit boards that meet IPC-6012/6013/6018 Class 2, Class 3 and Class 3/A qualifications.

Company Information

• Located in Irving, Texas

• Established in 1984

• ITAR Registered

• Quick Turn Prototypes, Pre-Production and Production

  • 2 – 60 layer capability

Industries Served:

  • Defense & Aerospace
  • Telecommunications
  • Semiconductor
  • Industrial
  • Contract Manufacturing
  • Medical
  • Automotive
  • Commercial

NetVia Group - an Epec Company

Epec Engineered Technologies is the ideal choice for an OEM seeking customized product solutions from a focused and agile partner having supported over 5,000 customers across all sectors of the electronics industry. By providing highly experienced technical resources, a proven manufacturing platform and the fastest delivery in the industry, we are able to provide cost effective and innovative solutions that deliver the highest reliability products to the market faster.

Our Philosophy

• Integrity in Business

• Deliver on promises

• Pay vendors on time

• Act as a good corporate citizen

• Accountability at all levels – employees, management, and partners

• Pride and Belief in Domestic Manufacturing

• Reinvest > 90% of profits into the business

• Target capital equipment, acquisition of talent, investment in efficiency

• Focus on value – for all expenditures of time and resources, ask: “How does this benefit my customer?”

What We Do

For more detailed information on our capabilities, please see the technology page, above.  The majority of our work involves the following:


  • Rogers RO4350, RO4003, RO6035HTC, RO6002, RO3006, TMM and 2929 bondply material fabrication for RF applications
  • Taconic RF-35, TLX/TLY, TSM-DS3b and Fastrise for RF applications
  • Arlon DiClad, CuClad and CLTE for RF applications
  • Panasonic Megtron 6 & 7
  • Isola 185HR, 370HR and FR408HR for enhanced FR4 applications, including RoHS compliant as well as lower loss
  • Polyimide multilayers for military, aerospace and the oil and gas industries


  • Blind and/or buried vias, which account for approximately 40% of our work
  • Conductive and non-conductive filled vias (ie. VIP or via-in-pad technology), which accounts for better than 50% of the part numbers we build
  • Controlled depth pockets, both plated and non-plated for various mechanical requirements
  • Mixed package designs, where we bond and process different materials together
  • Expertise in edge plating and castellation holes through a well developed process
  • Etched resistors on 25, 50, 100 and 250 ohms per square (Ticer and OhmegaPly)
  • Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG), in house and regarded as the most superior surface finish available and is also compatible with wire bond applications
  • Microvias down to 0.004”, including 1+N+1, 2+N+2 and 3+N+3 stacked and/or staggered construction
  • Copper and Aluminum bonded boards for heavy thermal dissipation

When your requirements demand attention to detail or when others no bid the job due to complexity, this is where we find the opportunity. We would welcome a discussion on your next project and we are sure our technical expertise will become evident. 

If you would like more information about some of the common materials we use, we suggest you visit these websites: